The LSP series solder pot uses PID microprocessor temperature controller, the temperature is stable and the temperature difference is very small. It saves power up to 30% than normal microcomputer-based control system.

LSP Solder Pot

Solder Pot Specifications

Temp. Range: Adjustable up to 600°C; actual working temperature up to 400°C

Soldering Pot

Normal Solder Pot, material: 304 stainless steel. NOT applicable for lead-free solder

[table]

Model, LSP1510B, LSP2015B, LSP2520B, LSP3025B, LSP3530B

Pot Size, 150*100*70mm, 200*150*70mm, 250*200*70mm, 300*250*70mm, 350*300*70mm

Capacity, 7.5 KG, 15 KG, 25 KG, 38 KG, 53 KG

Power, 600W, 1200W, 1500W, 2000W, 2200W

Dimension, 370*160*140mm, 420*210*140mm, 470*260*140mm, 520*310*140mm, 570*360*140mm

[/table]

Lead free Solder Pot

Lead-free solder pot, material: titanium alloy

[table]

Model, LSP1510D, LSP2015D, LSP2520D, LSP3025D, LSP3530D

Pot Size, 150*100*70mm, 200*150*70mm, 250*200*70mm, 300*250*70mm, 350*300*70mm

Capacity, 7.5 KG, 15 KG, 25 KG, 38 KG, 53 KG

Power, 600W, 1200W, 1500W, 2000W, 2200W

Dimension, 370*160*140mm, 420*210*140mm, 470*260*140mm, 520*310*140mm, 570*360*140mm

[/table]

Features of the Soldering Pot

  1. PID microprocessor temperature controller.
    PID controller
    – Save power up to 30%
    – Temperature accuracy up to ±1%
  2. Internal heating type, the use rato of power reaches up to 80%; while the other heating type can only reach 70%
  3. Built in temperature detector and several heating tube, detecting temperature quickly and control the temperature accurately
    heater
  4. Solder residue collecting tank, it is separate to the solder pot, the solder residue can be collected and re-use.
    splash
  5. When the temperature reaches preset degree, the constant temperature system works and the power output will automatically reduce. The life of heating tube is 3 times longer than normal heating wire.
    temp

 

 

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