LSP Series Solder Pot for Dip Soldering

The LSP series solder pot uses PID microprocessor temperature controller, the temperature is stable and the temperature difference is very small. It saves power up to 30% than normal microcomputer-based control system.

LSP Solder Pot

Solder Pot Specifications

Temp. Range: Adjustable up to 600°C; actual working temperature up to 400°C

Soldering Pot

Normal Solder Pot, material: 304 stainless steel. NOT applicable for lead-free solder

Model LSP1510B LSP2015B LSP2520B LSP3025B LSP3530B
Pot Size 150*100*70mm 200*150*70mm 250*200*70mm 300*250*70mm 350*300*70mm
Capacity 7.5 KG 15 KG 25 KG 38 KG 53 KG
Power 600W 1200W 1500W 2000W 2200W
Dimension 370*160*140mm 420*210*140mm 470*260*140mm 520*310*140mm 570*360*140mm

Lead free Solder Pot

Lead-free solder pot, material: titanium alloy

Model LSP1510D LSP2015D LSP2520D LSP3025D LSP3530D
Pot Size 150*100*70mm 200*150*70mm 250*200*70mm 300*250*70mm 350*300*70mm
Capacity 7.5 KG 15 KG 25 KG 38 KG 53 KG
Power 600W 1200W 1500W 2000W 2200W
Dimension 370*160*140mm 420*210*140mm 470*260*140mm 520*310*140mm 570*360*140mm

Features of the Soldering Pot

  1. PID microprocessor temperature controller.
    PID controller
    – Save power up to 30%
    – Temperature accuracy up to ±1%
  2. Internal heating type, the use rato of power reaches up to 80%; while the other heating type can only reach 70%
  3. Built in temperature detector and several heating tube, detecting temperature quickly and control the temperature accurately
    heater
  4. Solder residue collecting tank, it is separate to the solder pot, the solder residue can be collected and re-use.
    splash
  5. When the temperature reaches preset degree, the constant temperature system works and the power output will automatically reduce. The life of heating tube is 3 times longer than normal heating wire.
    temp

 

 

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